Full wafer DualBeam™ systems accommodating multiple sample and imaging requirements
Expida™ DualBeam™ systems from FEI improve process development and root cause analysis applications. The Expida family includes three full wafer DualBeam systems that accommodate near-fab semiconductor manufacturing support laboratories, and the 300mm full wafer capability of each microscope integrates flawlessly with inspection and control processes.
Leading semiconductor manufacturers use Expida DualBeam systems for accurate 3D defect characterization and improved yields. Key applications include defect characterization, failure analysis and transmission electron microscope (TEM) sample preparation. Microscopes from the Expida Family provide faster results, lower costs, greater analytical throughput and higher quality information than conventional analytical procedures in outside laboratories.
Featured Tools in the Expida Family
The New Expida 1255S [PDF 904KB] is the first and only integrated wafer DualBeam/STEM system that integrates wafer sample preparation, imaging and analysis for faster time to data and market. The Expida 1255S incorporates field-proven DualBeam technology, an STEM detector for 30kV STEM imaging and includes in-situ TEM sample lift-out and handling. Semiconductor labs can now prepare, image and analyze wafer samples in one system, with higher-throughput than ever before. The integrated Expida 1255S system extends the capabilities of the Expida family through improvements to the Sirion™ electron column, a 14-segment STEM detector and assures correct end-pointing and precise lamella thickness by enabling STEM imaging while milling the TEM sample to its final location and thickness.
The FEI Expida 1255 [PDF 183KB] DualBeam system combines high-resolution scanning electron microscope (SEM) imaging with focused ion beam (FIB) imaging and milling for process development and root cause analysis applications. Its full wafer capability integrates with in-fab inspection and control processes, and its ability to provide high resolution images and analysis of sub surface features and buried defects is essential in developing and controlling advanced semiconductor manufacturing processes. The Expida 1255 includes a single-wafer loadlock designed to handle full or partial wafers up to 300mm, as well as packaged parts.
The FEI Expida 1285 [PDF 288KB] offers the ultimate in defect characterization, failure analysis and TEM sample preparation on patterned and unpatterned wafers. With fast and accurate 3D defect characterization, you get increased control and improved yield. The Expida 1285 includes an integrated front-end module designed to simultaneously handle 200mm and 300mm wafers using load port modules.
Applications
The Expida Family includes microscopy tools for the following semiconductor applications:
- Process development and control
- Fault isolation
- Failure analysis
- TEM sample preparation